LIQUID RESIN COMPOSITION FOR SEALING USED FOR UNDERFILL AND SEMICONDUCTOR DEVICE USING THE SAME AND MANUFACTURING METHOD FOR THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a liquid resin composition for sealing used for an underfill having reduced cracks and warpages by dispersing silica filler suitably for relieving the stress in the resin. SOLUTION: The liquid-form sealing resin composition for an underfill comprises: (A) an epoxy resin; (B) an aromatic amine hardening agent represented by the formula (1); (C) a silica filler with its surface substantially entirely covered by isolated silanol groups; and (D) a silane coupling agent. In the formula, R1is a hydrogen atom or a 1-4C alkyl group and R2is either a hydrogen atom, a 1-3C alkyl group or an electron attracting group. R1and R2can be different and n is a natural number. COPYRIGHT: (C)2006,JPO&NCIPI