发明名称 SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND SUBSTRATE PROCESSING PROGRAM
摘要 PROBLEM TO BE SOLVED: To shorten remarkably a tact time for processing operation of supplying processing liquid to a substrate to be processed or applying the same on the substrate to be processed through spinless system. SOLUTION: A zone wherein a first substrate transfer unit 84A and a second substrate transfer unit 84B retain and transfer the substrate G together is not a total transfer zone from a carry-in position to a carry-out position but an intermediate zone from the starting position of application to the finishing position of application. The first substrate transfer unit 84A finishes the role of transfer for the substrate G at a time when the substrate G<SB>i</SB>is transferred to the finishing position of application, and immediately returns to the carry-in position to start the transfer of a succeeding new substrate G<SB>i+1</SB>. On the other hand, the second substrate transfer unit 84B transfers individually the substrate G<SB>i</SB>from the finishing position of application to the carry-out position, subsequently, returns to the starting position of application before the carry-in position, and waits for the first substrate transfer unit 84A which transfers individually the next substrate G<SB>i+1</SB>to that position. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006237482(A) 申请公布日期 2006.09.07
申请号 JP20050053239 申请日期 2005.02.28
申请人 TOKYO ELECTRON LTD 发明人 OTSUKA KEISUU;NAKAMITSU TAKASHI
分类号 H01L21/027;B05C5/02;B05C13/02;B05D3/00;B65G49/06;H01L21/677 主分类号 H01L21/027
代理机构 代理人
主权项
地址