| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of dicing where a die bond film hardly remains on a dicing line. SOLUTION: The method of dicing has processes of: cutting the dicing line of a semiconductor wafer to which the die bond film is pasted by upper cut using a blade; and cutting the dicing line cut by the upper cut, by down cut using the blade. COPYRIGHT: (C)2006,JPO&NCIPI |
