| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame which prevents the disconnection caused between an electrode of an semiconductor device and a lead part due to the peeling of the lead part from a sealing resin by thermal expansion of each material which constitutes a resin sealed semiconductor device under high temperature environment at the time of mounting on a substrate, and also to provide the resin sealed semiconductor device using the lead frame and a method for manufacturing it. SOLUTION: A lead is connected to a frame so that a metal thin wire 4 is easily connected. In a lead part 3c of the lead which forms an innermost terminal located in a lower surface of a semiconductor element 2, a peeling stop part 7 for resin is formed on the lead. COPYRIGHT: (C)2006,JPO&NCIPI
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