发明名称 DOPING METHOD TO SOLID FILM AND DOPING PATTERN FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a doping method to a solid film, and to provide a doping pattern forming method. SOLUTION: The doping method comprises: a stage where a solid surface is formed on a substrate; a stage where a dopant solution is made adjacent to the solid surface via a hollow member holding the dopant solution; and a stage where, with the substrate as either electrode, voltage is applied to the dopant solution, and the dopant is doped to the solid into a pattern shape. The solid comprises a material selected from oxides, organic matters and organic-inorganic composite materials. In the doping pattern forming method, a dopant is doped into a pattern shape. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006233276(A) 申请公布日期 2006.09.07
申请号 JP20050049849 申请日期 2005.02.25
申请人 TOKYO INSTITUTE OF TECHNOLOGY 发明人 YANO TETSUJI;SHIBATA SHUICHI
分类号 C25B7/00 主分类号 C25B7/00
代理机构 代理人
主权项
地址