发明名称 |
Flip chip substrate design |
摘要 |
A chip device that includes a leadframe that has a die attach cavity. The memory device further includes a die that is placed within the die attach cavity. The die attach cavity is substantially the same thickness as the die. The die is positioned within the cavity and is attached therein with a standard die attachment procedure.
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申请公布号 |
US7101734(B2) |
申请公布日期 |
2006.09.05 |
申请号 |
US20030660866 |
申请日期 |
2003.09.11 |
申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION |
发明人 |
GRANADA HONORIO T.;JOSHI RAJEEV;TANGPUZ CONNIE |
分类号 |
H01L21/44;H01L23/12;H01L23/04;H01L23/31 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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