发明名称 COMPONENT PUNCHING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a component punching method enabling a cutting line to be accurately placed along the outline of a punched part of a tape-like member when the punched part is placed in a die set. <P>SOLUTION: The component punching method comprises steps of photographing a positioning hole and the punched part of the tape-like member 20, detecting the position relation between the positioning hole and the punched part from a photographed image, adjusting the position of the die set 43 with respect to a positioning pin 44 based on the position relation between the positioning hole and the punched part so that the cutting line is placed along the outline of the punched part when the punched part is placed within the die set 43, and placing the punched part in the die set 43 in the inserted state of the positioning pin 44 into the positioning hole and punching the punched part with the die set 43 to produce a component. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006212754(A) 申请公布日期 2006.08.17
申请号 JP20050029373 申请日期 2005.02.04
申请人 FUJI PHOTO FILM CO LTD 发明人 HATANO YASUSHI
分类号 B26F1/00 主分类号 B26F1/00
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