| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To miniaturize and thin a semiconductor device and improve mounting performance. <P>SOLUTION: The semiconductor device has a semiconductor chip with an electrode in a first surface, a first part consisting of an insulating plate, and a second part which is extended from the first part and is thinner than the first part. The first surfaces of the first part and the second part are positioned on the same plane, and the first surface is bonded to the first surface of the semiconductor chip aside an arrangement position of an electrode via an insulating adhesive. The second surfaces of the first part and the second part, which are opposite surfaces of the first surface have a plurality of conductor layers, respectively. The prescribed conductor layer of the first part and the prescribed conductor layer of the second part have a wiring block formed of a structure to be electrically connected via a conductor provided to an inside; a conductive wire connecting the prescribed conductor layer of the second part of a wiring block and a prescribed electrode of the semiconductor chip; and an insulating sealing body covering the first surface of the semiconductor chip, the second part of the wiring block, and the wire. The surface of the sealing body is lower than the second surface of the first part of the wiring block by a prescribed height. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
