发明名称 PRESSURE SENSOR AND MANUFACTURING METHOD THEREFOR
摘要 <p><P>PROBLEM TO BE SOLVED: To properly protect a sensor chip and to properly prevent electric leakage, even in constitution of bringing a pressure medium into direct contact with a pressure receiving face of the sensor chip or a bonding wire connected thereto, in a pressure sensor with the sensor chip provided in a casing having a terminal, and constituted to connect the terminal electrically to the sensor chip. <P>SOLUTION: The pressure medium is directly introduced from a pressure introducing hole 32 into the pressure receiving face 20a of the sensor chip 20 provided in the casing 10, an intermediate part between one end part and the other end part of the bonding wire 13 is coated with the first electric-insulating coating material 51 having resistance against the pressure medium, and a connection part of the bonding wire 13 to the sensor chip 20, a connection part of the bonding wire 13 to the terminal 12, and the pressure receiving face 20a of the sensor chip 20 are coated with the second electric-insulating coating material 52 having resistance against the pressure medium. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006208088(A) 申请公布日期 2006.08.10
申请号 JP20050018458 申请日期 2005.01.26
申请人 DENSO CORP 发明人 TSUDA HIROSHI;IKEZAWA TOSHIYA
分类号 G01L19/06 主分类号 G01L19/06
代理机构 代理人
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