| 摘要 |
PROBLEM TO BE SOLVED: To provide a die-bonding technology for rapidly picking up a chip pasted to a dicing tape via a die attach film. SOLUTION: By lowering an expand ring 12 of a pickup device 10 and pressing down a wafer ring 6 bonded to the periphery of the dicing tape 5 downwards, the dicing tape 5 is applied with strong tension from the center toward the periphery and thereby is expanded horizontally without surface waviness, which causes the die attach film 4 to be expanded and cut and separated per chip unit. Next, after the expand ring 12 is raised slightly at a low speed to make smaller the horizontal tension applied to the dicing tape 5, chips 1 and the die attach films 4 are delaminated from the dicing tape 5. COPYRIGHT: (C)2006,JPO&NCIPI |
