| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board whereby occurrence of smear can be reduced and sufficiently eliminated, as formed inside of blind vias and at the surrounding of opening edges caused when the blind vias are formed through the emission of a laser beam and to provide the circuit board. SOLUTION: The circuit board includes a resin layer and a conductor layer, and is formed with the blind vias. The resin layer is provided with a protection layer for protecting the resin layer on a side opposite to the side of the conductor layer. The manufacturing method of the board includes a step of forming the blind via holes by emitting the laser beam to the resin layer and the protective layer, and a step of removing the protection layer after the forming of the blind vias. The emission of the laser beam is carried out in a manner of defocusing the focus so as to be deviated in an optical axis direction with respect to the surface of the protection layer. COPYRIGHT: (C)2006,JPO&NCIPI
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