| 摘要 |
A chip package including a carrier, a chip, a stiffener and a molding compound is provided. A producing method of the chip package includes the steps of disposing a bottom surface of the chip on the carrier; covering an edge of a top surface of the chip with the stiffener for protecting the edge; then wire bonding the top surface of the chip with the carrier; and forming the molding compound for encapsulating the chip, the stiffener and parts of the carrier.
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