CMP PAD HAVING GROOVE SEGMENT ARRANGEMENT PATTERN ALTERNATELY LOCATED IN RADIAL DIRECTION

摘要

PROBLEM TO BE SOLVED: To improve polishing performance by controlling a groove segment arrangement pattern of a polishing pad.

SOLUTION: The polishing pad 104 has an annular polishing track 122, and includes a plurality of grooves 148 which cross the polishing track. The respective grooves include a plurality of flow control segments CS1 to CS3, and at least two discontinuous inclination portions located in the polishing track.

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