| 摘要 |
<p>The present invention comprises methods and compositions of dielectric materials. The dielectric materials of the present invention comprise materials having a dielectric constant of more than 1.0 and less than 1.9, or a dissipation factor of less than 0.0009, or a material having a dielectric constant of more than 1.0 and less than 1.9, and a dissipation factor of less than 0.0009. Other characteristics include the ability to withstand a wide range of temperatures, from both high temperatures of approximately +260° C to low temperatures of approximately -200° C, operate in wide range of atmospheric conditions and pressures, such as a high atmosphere, low vacuum such as found in outer space as well as at sea level or below sea level, and is used in the manufacture of composite structures that can be used alone or in combination with other materials, and can be used in electronic components or devices.</p> |
