LASER BEAM MACHINING METHOD FOR CERAMIC SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To form a point for the absorption of laser beams in a ceramic substrate in a short time and to improve the ability of a process for forming a partition channel with regard to a laser beam machining method for forming the partition channel in the ceramic substrate by laser beam machining.

SOLUTION: The laser beam machining method for the ceramic substrate 1 comprises; in the machining method for forming the partition channel 4 for a break in the ceramic substrate 1 by a laser, a working channel 6 is formed in advance to intersect the partition channel 4; and the partition channel 4 is formed to cross the working channel 6.

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