| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible printed wiring board and a multilayer flexible printed wiring board which prevent the adhesion of an FPC substrate of a bent part and which can hold a sufficient flexing resistance, in a method of laminating the board having a non-adhesive part and an adhesive part. SOLUTION: The flexible printed wiring board includes at least an electric insulating layer and a conductor layer so that the ten-point average of the roughness of the above electric insulating layer front surface is 1.5μm or more to less than 2.0μm, and a contact angle is 60°or more to less than 120°, or ten-point average of the roughness is 2.0μm or more to less than 4.0μm, and two or more lamination of the flexible printed wiring board is performed. In the state which can be flexed and exposed, the electric insulation layer surfaces of the two or more flexible printed wiring boards counter, is in a non-adhesive state, and the part of the wiring board is laminated on the first multilayer printed wiring board and the second multilayer printed wiring board, respectively. COPYRIGHT: (C)2006,JPO&NCIPI |
