| 发明名称 |
Insulation sheet and apparatus utilizing the same |
| 摘要 |
An insulation sheet is formed by a heat conductive filler of an amount of 70-93 mass % in an organopolysiloxane base material. The content of conductive impurities in the insulation sheet is 500 ppm or less. The insulation sheet according to one embodiment is interposed between a semiconductor device and a heat sink.
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| 申请公布号 |
US7081670(B2) |
申请公布日期 |
2006.07.25 |
| 申请号 |
US20040914282 |
申请日期 |
2004.08.10 |
| 申请人 |
NISSAN MOTOR CO., LTD. |
发明人 |
SHIBUYA AKIHIRO;FURUKAWA MOTOYUKI;NARUSE MIKIO;EHIRA ATSUSHI;OGAWA KAZUHIRO;OOTA HIROTOSHI;ABE KAZUYOSHI |
| 分类号 |
H01L23/10;H01L23/36;H01L23/34;H01L23/373;H01L23/40;H01L23/473 |
主分类号 |
H01L23/10 |
| 代理机构 |
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代理人 |
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