| 摘要 |
An apparatus for positioning an object having a substrate and an overlying film and a portion of a photolithography apparatus relative to one another includes a photolithography apparatus relative to one another includes a photolithography system, a positioner, an optical system, and a processor. The photolithography system is configured to illuminate a portion of an object with an first light pattern and includes a reference surface. The positioner can change a relative position between the photolithography system and the object. The light projector is configured to project a second light pattern on the overlying thin film of the object. The optical system images light of the second light pattern that is diffusely scattered by the substrate. The processor is configured to determine a spatial property of the object based on the diffusely scatterd light and operate the positioner to change the relative position between the photolitography system and the object.
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