| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an ultra-small and thin chip resistor and its manufacturing method by which it is possible to produce as many chip resistors as possible from an insulating substrate of a prescribed dimension, to prevent occurrence of bleeding and droops accompanied with printing of a resistance paste, to uniformly form the thickness of a resistor film, and to obtain excellent shape accuracy of the divided face of a protection coat film and the split face accompanied with splitting of the insulating substrate. <P>SOLUTION: The insulating substrate is used in which a splitting groove is not engraved beforehand. A plurality of pairs of electrode films are formed in the prescribed region of the insulating substrate. A plurality of belt-like resistor films are dried after printing them so as to be partially superposed on each pair of the electrode films. Unnecessary parts of the dried belt-like resistor films are removed. The resistor films left behind after the removal are calcinated. At least a plurality of the belt-like protection coat films are formed on the resistor films. The protection coat films and the electrode films are divided vertically and horizontally at prescribed intervals. Simultaneously, the splitting grooves are engraved on the insulating substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
