| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a semiconductor device capable of quantitatively evaluating the variation of an exposure and a focus position. <P>SOLUTION: The evaluation pattern formed on the main surface of a semiconductor wafer to evaluate an exposure condition comprises a first evaluation pattern consisting of a remainder pattern, and a second evaluation pattern consisting of a remainder pattern formed in a location lower than the first evaluation pattern in the optical axis direction in an exposure device. The steps are included for forming a plurality of the first evaluation pattern and the second evaluation pattern on a first semiconductor wafer using a plurality of exposure conditions wherein the exposure and the focus position are changed respectively, measuring the dimensions of the first evaluation pattern and the second evaluation pattern, computing a first dimensional difference and a first mean value between the measured dimension of the first evaluation pattern and the measured dimension of the second evaluation pattern which are formed at the same exposure and the same focus position, and creating basic data for the exposure condition based on the first dimensional difference and the first mean value. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
