SENSOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a sensor device which reduces a temperature drift in sensor characteristics, and to provide a method of manufacturing the sensor device.

SOLUTION: The sensor device 10 includes a sensor body 1 which uses a silicon as a substrate, and an upper seal 2 and a lower seal 3 which also use a silicon as a substrate. An integrated circuit 20 which drives the sensor device 10 forms a laminate with the sensor device 10. The sensor body 1 connects with the circuit pattern 12 of the integrated circuit 20 electrically through a through electric path 4 which penetrates the upper seal 2 and an electrode 5 for packaging provided in the external surface of the upper seal 2. The sensor device 10 is connected with an MID substrate 30 through the integrated circuit 20.

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