发明名称 |
Semiconductor wafer and manufacturing process thereof |
摘要 |
A semiconductor wafer includes a wafer body, a plurality of analog IC dies spacedly and alignedly formed on the wafer body to define a scribe line as a margin formed between each two dies wherein each of the dies has an internal circuit formed therewithin and at least a terminal pad formed along the scribe line, and a conductive arrangement including at least a conductive element formed on the wafer body to electrically connect the terminal pad with the internal circuit of the die in such a manner that when the die is cut off from the wafer body along the scribe line, the terminal pad is cut off from the die so as to keep the internal circuit in the die.
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申请公布号 |
US7075107(B2) |
申请公布日期 |
2006.07.11 |
申请号 |
US20040841035 |
申请日期 |
2004.05.06 |
申请人 |
ADVANCED ANALOG TECHNOLOGY, INC |
发明人 |
CHEN WEI-JUNG;CHANG YUNG-CHING;HUANG JAW-SHIN;FANG CHENG-YU;YU CHIEN-PENG |
分类号 |
H01L23/58;H01L21/301;H01L21/44;H01L23/544 |
主分类号 |
H01L23/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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