发明名称 MOLD RELEASE POLYESTER FILM FOR HOT PRESS MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a mold release polyester film for hot press molding capable of reducing staining especially at the time of production of a flexible printed circuit board (FPC) at the time of hot press molding, causing no protrusion of a resin and imparting sufficient mold releasability. SOLUTION: The mold release polyester film for hot press molding is a polyester film having a mold release layer provided at least on its one side and characterized in that the polyester is used in a hot pressing process. The heat shrinkage factor thereof at 180°C for 5 min is preferably 5% or below. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006175637(A) 申请公布日期 2006.07.06
申请号 JP20040369164 申请日期 2004.12.21
申请人 MITSUBISHI POLYESTER FILM COPP 发明人 KAWASAKI YASUSHI;KANDA TOSHIHIRO;FUJITA MASATO
分类号 B32B27/00;B32B27/36 主分类号 B32B27/00
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