发明名称 |
MOLD RELEASE POLYESTER FILM FOR HOT PRESS MOLDING |
摘要 |
PROBLEM TO BE SOLVED: To provide a mold release polyester film for hot press molding capable of reducing staining especially at the time of production of a flexible printed circuit board (FPC) at the time of hot press molding, causing no protrusion of a resin and imparting sufficient mold releasability. SOLUTION: The mold release polyester film for hot press molding is a polyester film having a mold release layer provided at least on its one side and characterized in that the polyester is used in a hot pressing process. The heat shrinkage factor thereof at 180°C for 5 min is preferably 5% or below. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006175637(A) |
申请公布日期 |
2006.07.06 |
申请号 |
JP20040369164 |
申请日期 |
2004.12.21 |
申请人 |
MITSUBISHI POLYESTER FILM COPP |
发明人 |
KAWASAKI YASUSHI;KANDA TOSHIHIRO;FUJITA MASATO |
分类号 |
B32B27/00;B32B27/36 |
主分类号 |
B32B27/00 |
代理机构 |
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