| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that chemical for processing and impurities in atmosphere invade into a device through a crack as a route when the crack goes into a glass substrate bonded to a device-side during the work processing of a semiconductor wafer and that inconvenience occurs in the semiconductor device. <P>SOLUTION: The semiconductor device is provided with a support body 4 bonded to a semiconductor substrate where first wiring 3 is formed through adhesive, second wiring 8 which is connected to first wiring 3 and is extended to the rear face of the semiconductor substrate through an insulating film 6, and a protection film 10 formed on second wiring 8. In the support body 4, a substrate 4a formed of resin and the glass substrate 4b are laminated. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
