| 摘要 |
A device includes a plurality of organic electronic devices disposed on a substrate, wherein each of the organic electronic devices comprises a first electrode and a second electrode. Furthermore, the device includes an organic layer disposed between the first and second electrodes of each of the plurality of organic electronic devices. Additionally, the device includes an interconnect element, wherein the interconnect element is configured to electrically couple the respective first and second electrodes of each of the plurality of organic electronic devices.
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