SEMICONDUCTOR MEMORY DEVICE HAVING CHARGE-TRAPPING MEMORY CELLS

摘要

The memory cell is arranged in a ridge (15) of semiconductor material forming a fin (1) with sidewalls and a channel region between source and drain regions (2). Memory layer sequences (4), such as ONO, provided for charge-trapping are applied to the sidewalls, and gate electrodes are arranged on both sides of the ridge. A plurality of ridges at a distance parallel to one another and have sidewalls facing a neighboring ridge form an array of charge-trapping memory cells. Wordlines are arranged between the ridges, sections of the wordlines forming the gate electrodes (3). This arrangement enables a double gate operation of the cells and thus allows for a storage of four bits of information in every single memory cell structure.