发明名称 Metal contact LGA socket
摘要 A socket which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. The molded inserts are receivable in the apertures of the substrate and are later swaged to retain them and the contacts to the substrate. Pins are securely located on the substrate, which are used to align the interconnect with the electrical component for connection.
申请公布号 US7059869(B2) 申请公布日期 2006.06.13
申请号 US20040789043 申请日期 2004.02.27
申请人 TYCO ELECTRONICS CORPORATION 发明人 WERTZ DARRELL L;WHYNE RICHARD N;MCCLINTON JEFFREY B
分类号 H01R12/00;H01R13/24;H01R13/629;H05K7/10 主分类号 H01R12/00
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