| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a conversion board and a semiconductor device using the same for the easy matching of wiring impedance on a motherboard when a semiconductor package is mounted on a motherboard or a printed board. <P>SOLUTION: A conversion board (30) is used for mounting a semiconductor package (10) on a motherboard (20). It comprises multiple connection terminals (32) dotted lengthwise and crosswise in a plurality of lines on a top surface, and multiple connection terminals (34) dotted on a bottom surface lengthwise and crosswise in multiple lines at array pitches larger than those of connection terminals on the top surface. The conversion board is composed of an upper layer of a rigid material, a bottom layer of a rigid material, and one or more flexible layers (46) arranged between the upper layer and the bottom layer, and layered as a laminate. The connection terminals (32) on the upper surface are connected to the connection terminals (34) on the bottom surface via a pattern (50) and a via (52). <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
