| 摘要 |
PROBLEM TO BE SOLVED: To evaluate poor bonding in face down mounting (surface mounting) semiconductor device, where the surface side of a semiconductor chip is connected with a mounting substrate. SOLUTION: When a semiconductor chip 10 is composed of a transparent material similar to a light-emitting diode 1 fabricated by forming gallium nitride based compound semiconductor layers 12 and 13 on a transparent sapphire substrate 11, an aperture window 30 that does not form electrodes 15 and 16 is formed, at least partially at the abutting portion of bump electrodes 21a and 21b in the electrodes 15 and 16 being formed on the surface of the semiconductor chip 10 so that the junction of the electrodes 15, 16 and the bump electrodes 21a, 21b can be checked through the aperture window 30. Consequently, it can be determined whether the bump electrodes 21a and 21b have sufficient particle size and whether the aperture window 30 is filled as a result of dissolution by hot press. COPYRIGHT: (C)2006,JPO&NCIPI |
