| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a bump forming method and a structure for bonding in which a high jointing strength is provided after bump bonding or frip chip bonding, even with a thin film wiring, with less degradation and secular change even after thermal history thereafter. <P>SOLUTION: In the bump forming method, a buffer layer 2 is formed on a substrate 1 on which a bump jointing part 3 is formed, and a bump 4 is formed on the bump jointing part. The alloy comprising the material which constitutes the buffer layer, bump jointing part, and bump is diffused in the substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
