发明名称 COOLING DEVICE OF ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To miniaturize a cooling device in an electronic device for cooling the electronic device by using cooling water, and to improve cooling efficiency. SOLUTION: The cooling device of the electronic device comprises a cooler 22 that is thermally connected to the electronic device 26 for generating heat, and cools the electronic device 26 by forcibly supplying cooling water from a pump 25; and a heat exchange 23 that is thermally connected to the cooler 22, and radiates heat thermally conducting from the cooler 22 by forcibly supplying cooling air from a fan 31 into the air. The cooler 22 and the heat exchange 23 are connected directly thermally, and are arranged in the same housing 30. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006147722(A) 申请公布日期 2006.06.08
申请号 JP20040333562 申请日期 2004.11.17
申请人 FUJITSU LTD 发明人 KOBAYASHI SHINICHI
分类号 H05K7/20;F25D9/00;H01L23/467 主分类号 H05K7/20
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