| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a power semiconductor device which is capable of protecting a bonding wire etc against breakage, even when strong vibrations are applied to the power semiconductor device and absorbing the volume expansion of gel material, and to provide a method of manufacturing the same. <P>SOLUTION: The power semiconductor device includes a base plate, a power semiconductor element mounted on the base plate, a case fixed on the base plate so as to surround the power semiconductor element, a gel-like resin filling the case so as to cover the power semiconductor element, and a lid which is arranged and brought into close contact with the top surface of the gel-like resin and fixed to the case. The lid is equipped with an opening, through which the gel-like resin expands so as to protrude the outside. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
