EPOXY-BASED RESIN COMPOSITION, EPOXY RESIN-BASED ADHESIVE COMPOSITION, COVER LAY FOR FLEXIBLE PRINTED CIRCUIT BOARD, COPPER-CLAD LAMINATED BOARD FOR FLEXIBLE PRINTED CIRCUIT BOARD, THE RESULTANT FLEXIBLE PRINTED CIRCUIT BOARD, PREPREG, COPPER-CLAD LAMINATED BOARD, PHOTOSENSITIVE DRY FILM, PHOTOSENSITIVE LIQUID RESIST, AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To inhibit migration occurrence in various electronic materials made from an epoxy-based resin.

SOLUTION: An epoxy-based resin composition comprising the epoxy-based resin and a dicarboxylic acid is used. In this composition, the content of the dicarboxylic acid is preferably 10-50,000 ppm per total solids of the composition.

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