发明名称 SONOS type memory device
摘要 A SONOS type memory includes a semiconductor substrate, first and second impurity regions in the semiconductor substrate doped with impurity ions of a predetermined conductivity, separated a predetermined distance from each other, a channel region between the first and second impurity regions, and a data storage type stack on the semiconductor substrate between the first and second impurity regions. The data storage type stack includes a tunneling oxide layer, a memory node layer for storing data, a blocking oxide layer, and an electrode layer, which are sequentially formed. A dielectric constant of the memory node layer is higher than dielectric constants of the tunneling and the blocking oxide layers, and a band offset of the memory node layer is lower than band offsets of the tunneling and the blocking oxide layers. The tunneling oxide layer and the blocking oxide layer are high dielectric insulating layers.
申请公布号 US7053448(B2) 申请公布日期 2006.05.30
申请号 US20050070090 申请日期 2005.03.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JEON SANG-HUN;KIM CHUNG-WOO;MA DONG-JOON;CHOI SUNG-KYU
分类号 H01L21/8247;H01L29/792;H01L21/02;H01L21/28;H01L21/316;H01L27/10;H01L27/108;H01L27/115;H01L29/51;H01L29/788;H01L31/119 主分类号 H01L21/8247
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