| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit device of a resin-sealed type which is compatible with high heat-dissipation characteristics and high mounting density, even in applications in which high airtightness and environment-resistant property are required. SOLUTION: At least two or more wiring substrates 12, 13, on both of which electronic components are mounted, are fastened to a heat-diffusing plate 14 of high thermal conductivity via adhesives 9, 10. The wiring substrates 12, 13 as a whole and heat-diffusing plate 14, and a part of external connecting terminals 8 are sealed with a thermosetting resin composite 7 to be integrally molded, to form the electronic circuit device. Accordingly, a low-cost, compact, and high reliability electronic circuit device can be obtained. COPYRIGHT: (C)2006,JPO&NCIPI
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