| 发明名称 |
A SUBSTRATE HAVING A PENETRATING VIA AND WIRING CONNECTED TO THE PENETRATING VIA AND A METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
A substrate (50) includes a base member (51) having a through-hole (52), and a conductive metal filling in the through-hole (52) so as to form a penetrating via (55). The penetrating via (55) contains a conductive core member (58) that is substantially at the central axis of the through-hole (52). |
| 申请公布号 |
KR20060053282(A) |
申请公布日期 |
2006.05.19 |
| 申请号 |
KR20050096848 |
申请日期 |
2005.10.14 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
YAMANO TAKAHARU |
| 分类号 |
H01L21/28 |
主分类号 |
H01L21/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
