| 摘要 |
A flexible wiring board for tape carrier package having improved flame resistance is disclosed. The flexible wiring board has an insulating film having a bending slit, a wiring pattern formed thereon and crossing the bending slit, an adhesive layer adhering the wiring pattern to the insulating film, a flex resin layer protecting the wiring pattern at the bending slit, and an overcoat layer protecting the wiring pattern, in which the overcoat layer is obtained from a curable resin composition, when cured into a form of film, the film has an initial modulus of 10 to 1,500 MPa at 25° C., an electrical insulation of sufficient level, a soldering resistance of 10 seconds at 260° C., and an oxygen index exceeding 22.0. |
