| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting element and a light-emitting device which retain superior light-emitting characteristics, without hampering improvement in the heat dissipating properties and light extraction properties, are inexpensive, and are superior in mass productivity. <P>SOLUTION: The thick film of an Ni layer 50 and the thin films nope of an Au layer 51 formed on a surface of the Ni layer 50 compose a fusion welded junction 5, which is integrally constructed in a process of manufacturing an LED element 2. This results in dispensing with the conventional bump formation process, which leads to improvement in mass productivity and in cost reduction through reduction in man-hours. In addition, since the LED element 2 is free of inclination that will become a problem in carrying out flip mounting using stud bumps, superior mass productivity will result. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
