| 摘要 |
PROBLEM TO BE SOLVED: To realize a reduction of a mounting area, a decrease of a dead space, and a shortening of a wiring length when mounting a bare chip IC and a connector for electric connection on a printed wiring substrate etc., and in addition, to accomplish an effective measures to the breakaway of the bare chip IC caused from an impact. SOLUTION: The bare chip IC 3 and the connector 2 are mounted on both sides of the printed wiring substrate or flexible printed wiring substrate 1 in a layered form. The deflection of the printed wiring substrate or flexible printed wiring substrate 1 is suppressed due to the rigidity of the connector for electric connection 2, thereby obtaining the effect of breakaway suppression of the bare chip IC 3. COPYRIGHT: (C)2006,JPO&NCIPI
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