| 摘要 |
<p>Techniques for heat removal are provided. In one illustrative embodiment, a heat-transfer device is provided. The heat-transfer device comprises at least one heat-dissipating structure thermally connectable to at least one heat source, wherein the heat-dissipating structure comprises at least two components thermally coupled to each other and configured to slide relative to one another. In another illustrative embodiment, the heat-transfer device comprises at least one heat-dissipating structure thermally connectable to at least one heat source, wherein the heat-dissipating structure comprises at least two components thermally coupled to each other and configured to slide relative to one another, one or more of the components comprising one or more heat-dissipating fins configured to dissipate at least a portion of heat from the heat source to air proximate to the device.
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