| 摘要 |
The invention relates to a method for contacting pans of a component integrated into a semiconductor substrate ( 1 ). According to the inventive method, a first contact hole is produced in an insulating layer ( 2 ), said contact hole being then filled with contact material ( 16 ) and connected to a line. The aim of the invention is to minimise the processes required for contacting parts of a component integrated into a semiconductor substrate. To this end, the hard mask ( 3 ) used to produce the contact hole is also used to structure the line.
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