Resin solutions containing resol, cured resin layers formed using the same and methods of forming cured resin layers using the same,申请号KR20030073526-传众专利搜索

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发明名称	Resin solutions containing resol, cured resin layers formed using the same and methods of forming cured resin layers using the same
摘要
申请公布号	KR100576357(B1)	申请公布日期	2006.05.03
申请号	KR20030073526	申请日期	2003.10.21
申请人		发明人
分类号	G03F7/11;C08K3/00;C08L61/06	主分类号	G03F7/11
代理机构		代理人
主权项
地址

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