| 摘要 |
PROBLEM TO BE SOLVED: To provide a flow soldering apparatus which can decide whether delamination will occur in a soldered part, in a surface-mounting electronic component already mounted when flow soldering is applied. SOLUTION: A flow soldering apparatus 1 comprises a molten solder supplier 5 for supplying molten solder 30 to a printed circuit board 10 by bringing a jet of solder into contact with the printed circuit board 10, a noncontact displacement meter 6 for measuring warpage in the printed circuit board 10, after the molten solder 30 has been deposited on the board, and a data processing device 7 for deciding whether delamination has occured in a soldered part 31 in a surface-mounting electronic component 20, on the basis of the warpage measured by the noncontact displacement meter 6 and the size of the electronic component 20 previously mounted on the board 10. COPYRIGHT: (C)2006,JPO&NCIPI
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