| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing, having excellent continuous moldability including package appearance; and to provide an electronic part device having an element sealed with the epoxy resin molding material for sealing. SOLUTION: The epoxy resin molding material for sealing contains (A) an epoxy resin, (B) a curing agent, (C) an oxidation-type polyolefin, and (D) a substance including a compound having structures selected from two or more kinds of anα-olefin, a maleic anhydride derivative, a polyalkylene oxide derivative and a styrene derivative. The electronic part device is sealed with the molding material. COPYRIGHT: (C)2006,JPO&NCIPI
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