| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering material which can join electric or electronic parts such as a circuit substrate or a highly general-purpose metallic material such as stainless steel, in a short period of time at a low temperature and with high thermal efficiency. SOLUTION: A soldering fillet containing diamond microparticles is used in joining and mounting the parts by soldering. It is particularly preferable that the soldering fillet contains 0.01-10 wt.% of diamond microparticles produced in a synthetic explosion method, of which D50 (median volume diameter) is 20-500 nm. It is preferable to use a soldering fillet of such a material as a tin-zinc eutectic or a tin-silver-copper eutectic substance. COPYRIGHT: (C)2006,JPO&NCIPI
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