发明名称 RELIABLE PRINTED WIRING BOARD ASSEMBLY EMPLOYING PACKAGES WITH SOLDER JOINTS AND RELATED ASSEMBLY TECHNIQUE
摘要 An exemplary assembly (100) comprises a printed wiring board (102) having a first surface, and a package (104) including a plurality of solder joints, such as solder balls, on one surface of the package. An anchor via (116, 118) is defined through the first surface of the printed wiring board, and conductive material situated in the anchor via is connected to or integral with a respective solder joint of the package (104).
申请公布号 WO2006039246(A1) 申请公布日期 2006.04.13
申请号 WO2005US34481 申请日期 2005.09.26
申请人 KYOCERA WIRELESS CORP.;BORA, MUMTAZ, Y.;GIRARDOT, CHARLES, E. 发明人 BORA, MUMTAZ, Y.;GIRARDOT, CHARLES, E.
分类号 H05K3/34 主分类号 H05K3/34
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