| 发明名称 |
Semiconductor chip comprises a front section with a semiconductor functional element, and a rear section |
| 摘要 |
<p>Semiconductor chip (1) comprises a front section (3) with a semiconductor functional element, and a rear section (4). The rear section has at least one cut out (2). A section of the rear surface has a solderable metal layer (8).</p> |
| 申请公布号 |
DE102004058877(A1) |
申请公布日期 |
2006.04.13 |
| 申请号 |
DE20041058877 |
申请日期 |
2004.12.06 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
BAUER, MICHAEL;KESSLER, ANGELA;SCHOBER, WOLFGANG;HAIMERL, ALFRED;MAHLER, JOACHIM |
| 分类号 |
B81B1/00;B81C1/00;H01L21/50;H01L29/06;H01L31/0248;H01L33/00 |
主分类号 |
B81B1/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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