| 摘要 |
PROBLEM TO BE SOLVED: To provide a dielectric resin composition and a molding which have a large dielectric constant in the high frequency region of 1 GHz or more, have a small dielectric dissipation factor and a superior mechanical property and which is suitable for an antenna material for high frequency communication suitable for injection molding because of, especially its superior fluidity. SOLUTION: By using the dielectric resin composition by mixing a dielectric inorganic filler which has a maximum value of particle size distribution in 5μm or less and in 5-100μm and of which volume ratio in 5μm or less is 30%-65% and a resin, a dielectric resin molding is obtained which has a dielectric constant at the frequency of 1.0 GHz of 25 or more, a dielectric dissipation factor of 0.07 or less, a Charpy impact value without notch of 4.5 KJ/m<SP>2</SP>or more, and a bending strength of 70 MPa or more. COPYRIGHT: (C)2006,JPO&NCIPI
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