| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device using a core-less substrate with a cheap manufacturing cost by improving solder connection reliability, and also to provide a method of manufacturing it. SOLUTION: The semiconductor device is provided by: providing a recess 12 formed with the embedding solder plating external connection terminal 21 of a semiconductor package on a metal temporary substrate 11 with the weak solder plating adhesion force of a stainless alloy, etc.; forming a die pad 2b; wiring patterns 8, 9 and 10b for carrying a semiconductor element 2 on the metal temporary substrate 11 by a photoresist 13 and plating 14; forming the embedding solder plating external connection terminal 21 connected to the wiring patterns 8, 9 and 10b in the recess 12; then mounting the semiconductor element 2 in the die pad 2b; connecting the semiconductor element 2 to the wiring patterns 8, 9 and 10b; further forming the semiconductor package on the metal temporary substrate 11 by sealing the semiconductor element 2 on the metal temporary substrate 11 with a resin 5; and exfoliating the metal temporary substrate 11 from a semiconductor package. COPYRIGHT: (C)2006,JPO&NCIPI
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