| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing method for stably performing polishing even if the temperature on the surface of a polishing pad varies for each processing. <P>SOLUTION: A mechanism for supplying an abrasive 15 to the surface of the polishing pad 12 which is stuck to a surface plate 11 to perform polishing while pressing a substrate 13 comprises a mechanism 16 for measuring the surface temperatures of the polishing pad 12 during polishing, and a unit for collecting the measured surface temperatures to calculate the average value and the integration value during polishing processing. When the average and integration values fall below a predetermined reference value, the polished substrate is identified. The management of polishing amount by means of the average and integration values of the surface temperatures enables the stable polishing even with variations in the surface temperatures of the polishing pad. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
